

International Stand Out Scholarship
At Bond University
位置
Australia
資格
碩士, 大學
資金類型
Fee waiver/discount
最後期限
聯繫大學
獎金價值
未指定
關於獎學金
授予機構
Bond University平均每年申請人數
未指定
資格
碩士, 大學提供的獎勵數量
未指定
獎勵金額
未指定
適合學年
May - 2026, Sep - 2026, Jan - 2027
資金細節
As an International Stand Out Scholar, you will be awarded with 25% tuition remission for any single or approved combined undergraduate degree or postgraduate degree.
學習方式
未指定
繳交方式
未指定
課程申請截止日期
聯繫大學
資金類型
Fee waiver/discount獎勵分配
Selective
考慮了其他方面
Academic excellence
獎項可用於
Tuition fees
性別要求
All
國籍要求
Peru
Philippines
Singapore
Solomon Islands
South Africa
South Korea
Spain
Sri Lanka
Sweden
Switzerland
Taiwan
Thailand
Timor-Leste/East Timor
Tonga
Tuvalu
UAE
United States
Vanuatu
Vietnam
United Kingdom
Argentina
Bangladesh
Brazil
Cambodia
Chile
China
Colombia
Cook Islands
Denmark
Fiji
France
French Polynesia
Germany
India
Indonesia
Japan
Kenya
Kiribati
Malaysia
Marshall Islands
Mauritius
Mexico
Micronesia
Mongolia
Nauru
Nepal
New Caledonia
Nigeria
Norway
Oman
Pakistan
Palau
Papua New Guinea
你正申請的學科/課程
非特定學科選擇依據
Academic excellence
選擇標準
To be eligible to apply for this scholarship, you must:
Be an offshore international student (ie not an Australian citizen, New Zealand citizen or permanent resident) with citizenship from a country listed above, or an international student currently residing in Australia (any nationality).
If applying for undergraduate studies:
- have achieved, or are on track to achieve (conditional upon successful completion) academic excellence in the top percentile from your high school qualification equivalent to ATAR 90.00 or IB Diploma score of 32 or higher.
- not be completing, or have completed Australian year 12 onshore in Australia.
If applying for postgraduate studies:
- have achieved predetermined academic merit in your undergraduate studies.
- Meet the standard entry requirements for your chosen program of study.
- May have previously completed a Bond academic or English program.
International students will be automatically considered for this scholarship at time of application, based on the qualification you are assessed on for academic admission to the program.
Applications for Bond programs are always open therefore, your academic eligibility for this scholarship will be assessed at time of reviewing your program application.
If you are offered a scholarship, you will be provided with a deadline date to accept your program and scholarship offer.
獎學金截止日期:聯繫大學
申請流程:Separate application required
有關此獎金的更多訊息,請到大學或機構的獎學金頁面 學校獎學金頁面