

Transformer Scholarship
At Bond University
位置
Australia
資格
碩士, 大學
資金類型
Fee waiver/discount
最後期限
31 Aug 2026
獎金價值
50% of fees
關於獎學金
授予機構
Bond University平均每年申請人數
未指定
資格
碩士, 大學提供的獎勵數量
未指定
獎勵金額
50% of fees
適合學年
聯繫大學
資金細節
Provides 50% tuition remission for any undergraduate degree including approved combined programs up to 320 credit points (excluding the Bond Medical Program), or postgraduate degree (excluding research degrees).
學習方式
未指定
繳交方式
未指定
課程申請截止日期
聯繫大學
資金類型
Fee waiver/discount獎勵分配
All eligible
考慮了其他方面
Mature students
獎項可用於
Tuition fees
性別要求
All
國籍要求
All international
你正申請的學科/課程
非特定學科選擇依據
聯繫大學
選擇標準
To be eligible to apply for this scholarship, you must:
- Have strong leadership skills, community involvement and demonstrated potential to affect change
- Have had extensive involvement in extracurricular activities and
- Meet the entry requirements for your chosen program of study and commence in the following January semester.
What are the obligations of this scholarship?
- Transformer Scholarship recipients are expected to actively participate in and complete the Transformer program during their academic degree program. Participation in the Transformer commences immediately with academic studies.
- Suspension of participation in the Transformer program for academic or other reasons will result in termination of scholarship funding.
- Scholarship recipients must comply with Bond's general scholarship terms and conditions.
- The quality of the pitch video is the student's responsibility. The video submitted and received within the entry period is the version that will be judged. No subsequent versions will be accepted after the closing date.
- Video submissions must not include copyright material.
- The University may use excerpts of the videos submitted for entry for teaching purposes and to promote the competition to the public by whatever means it sees fit. This includes online, print and multimedia. We retain this right indefinitely.
If you meet the eligibility criteria for this scholarship, we encourage you to apply by following the below steps:
- Complete the Bond University Study Application Form to lodge your application for your chosen program. Learn more about this process.
- Complete the Bond University Scholarship Application Form. Simply use the same log-in details as used for your study application and enter 'scholarship' in the keyword field on the 'Start an Application' tab.
You must complete and submit your scholarship application before the application closing date as no late scholarship applications will be considered
獎學金截止日期:31 Aug 2026
申請流程:Separate application required
有關此獎金的更多訊息,請到大學或機構的獎學金頁面 學校獎學金頁面