

Transformer Scholarship
At Bond University
위치
Australia
자격
석사, 학사
자금 타입
Fee waiver/discount
마감일
31 Aug 2026
장학금 내역
50% of fees
장학금 개요
시상 기관
Bond University평균 지원자 수
지정되지 않음
자격
석사, 학사수여 대상자
지정되지 않음
장학금 내역
50% of fees
가능 입학시기
대학과 연락하기
자금 내역
Provides 50% tuition remission for any undergraduate degree including approved combined programs up to 320 credit points (excluding the Bond Medical Program), or postgraduate degree (excluding research degrees).
스터디 모드
지정되지 않음
학업 모드
지정되지 않음
과정 신청 마감일
대학과 연락하기
자금 타입
Fee waiver/discount수여금 배정
All eligible
기타 고려 사항
Mature students
수여금은 다음에 사용할 수 있습니다.
Tuition fees
성별 요구사항
All
국적 요건
All international
신청하는 과정 과목
특정 전공 없음선택 기준
대학과 연락하기
선정 기준
To be eligible to apply for this scholarship, you must:
- Have strong leadership skills, community involvement and demonstrated potential to affect change
- Have had extensive involvement in extracurricular activities and
- Meet the entry requirements for your chosen program of study and commence in the following January semester.
What are the obligations of this scholarship?
- Transformer Scholarship recipients are expected to actively participate in and complete the Transformer program during their academic degree program. Participation in the Transformer commences immediately with academic studies.
- Suspension of participation in the Transformer program for academic or other reasons will result in termination of scholarship funding.
- Scholarship recipients must comply with Bond's general scholarship terms and conditions.
- The quality of the pitch video is the student's responsibility. The video submitted and received within the entry period is the version that will be judged. No subsequent versions will be accepted after the closing date.
- Video submissions must not include copyright material.
- The University may use excerpts of the videos submitted for entry for teaching purposes and to promote the competition to the public by whatever means it sees fit. This includes online, print and multimedia. We retain this right indefinitely.
If you meet the eligibility criteria for this scholarship, we encourage you to apply by following the below steps:
- Complete the Bond University Study Application Form to lodge your application for your chosen program. Learn more about this process.
- Complete the Bond University Scholarship Application Form. Simply use the same log-in details as used for your study application and enter 'scholarship' in the keyword field on the 'Start an Application' tab.
You must complete and submit your scholarship application before the application closing date as no late scholarship applications will be considered
장학금 신청마감일:31 Aug 2026
입학 지원 절차:Separate application required
자세한 내용은 대학 장학금 페이지를 참고하세요. 학교 장학금 페이지